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D calculation boundary, which helped to characterize the sound MAC-VC-PABC-ST7612AA1 Data Sheet stress distribution
D calculation boundary, which helped to characterize the sound pressure distribution in the far-field limit.Sensors 2021, 21,14 ofThe size of each and every element was set to one tenth from the wavelength to balance the calculation accuracy and speed. The evaluation sort was harmonic, the solution approach was complete, the frequency was 1 MHz, the step was ten Hz, as well as the damping continuous coefficient was 0.05. Just after the answer was completed, the directive curve with the piezoelectric transducer might be obtained by post-processing. Figure 6a,b show the outcomes for a single-wafer transducer along with the four-laminated transducer.(a)(b)Figure 6. Directive curve of ultrasonic transducer ((a) single-wafer transducer and (b) four-laminated transducer).The half-angle spread refers Combretastatin A-1 Cell Cycle/DNA Damage towards the intersection angle in between the tangent on the primary lobe along with the adjacent side lobe as well as the axis on the key sound beam, also called the pointing angle. Denoted by 0 , it is actually expressed as follows [37]: 0 = arcsin(1.22 ), Ds (31)where would be the wavelength and Ds could be the wafer size. Inside the simulation course of action, the sound velocity of PZT-5 was 4350 m/s and also the wafer size was 24 mm. Based on the calculation, the half-angle spreads with the single-wafer and four-laminated transducers have been 12 and 3 , respectively. This was practically constant with the simulation benefits. The smaller sized the half-angle spread is, the a lot more concentrated the sound field energy is, as well as the greater the detection sensitivity becomes. Consequently, the four-laminated transducer had a greater sensitivity than the single-wafer transducer. The energy distribution with the ultrasonic transducer was mainly concentrated on the major lobe and side lobe of sound field. As shown in Figure 6, to get a single-wafer transducer, the acquire with the principal lobe was 170 dB, the maximum get of your side lobe was 155 dB, and their distribution variety was 120 . For the four-laminated transducer, the primary lobe achieve was 195 dB, the maximum obtain in the side lobe was 165 dB, and their distribution variety was also 120 . Thus, below the condition of nearly exactly the same power distribution variety, the gain with the four-laminated transducer was 25 dB higher than that with the single-wafer transducer. The reason was that the laminated transducer employed 4 four MHz piezoelectric wafers to type a 1-MHz cylindrical sound field via serial superposition. This additional proved that the four-laminated ultrasonic transducer having a frequency of 1 MHz was feasible. 3.three. Piezoelectric Components and Backing Material Bonding Typically, the piezoelectric elements are directly bonded towards the backing material by an adhesive. For that reason, the thickness of your adhesive layer must be as uniform and thin as possible with no bubbles. These specifications were met inside the present work by employing an epoxy resin using a ratio of 1:ten as the adhesive throughout the transducer manufacturingSensors 2021, 21,15 ofprocess. Following bonding, a specially made holder was applied to keep an sufficient speak to stress in between the piezoelectric components and the backing material throughout the curing procedure. Lastly, the bonded piezoelectric components and backing material, as well as the holder, had been placed together in an oven at one hundred C to cure for four h. three.four. Electrode Wire Connections Electrically conductive wires must be soldered meticulously for the piezoelectric components at an appropriate soldering temperature and for an acceptable soldering time for you to make certain optimal electrical connections, which are necessary for maintaini.

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